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High Purity Copper
- Sep 05, 2017 -

Element symbol CU, atomic number 29, atomic weight 63.55, peripheral electron arrangement 3d104s1, located in the Quaternary IB family. Atomic radius of 127.8 pi meters, + radius of 72, the first ionization energy is 750kj/mol, electronegativity 1.9, Common oxidation number + 1, +2. Violet-red shiny metal with good ductility and heat transfer and conductivity. Density 8.96g/cm3, melting point 1083.4 ± 0.2 ℃, boiling point 2,567 ℃. Chemical properties are not very lively, stable in dry air, in the humid air containing carbon dioxide easy to generate alkaline copper carbonate, commonly known as Patina (CU2 (OH) 2co3). Copper oxide was formed when heated with oxygen, the copper halide was formed with halogen reaction, and cuprous sulfide was formed by reaction with sulfur. Not reacting with water. Insoluble in acid and dilute sulfuric acid. Soluble in nitric acid and hot concentrated sulfuric acid. Also soluble in concentrated hydrochloric acid to generate H2cucl3 and H2. Slowly dissolve in ammonia. susceptible to alkali erosion. Mainly used in electrical industry, such as wire, cable, a variety of electrical equipment. Also used for the production of various alloys, such as brass, bronze, copper and nickel, and also used for electroplating. Copper was found in ancient times, and the main minerals were chalcopyrite (CuFeS2), Chalcocite (cu2s), Red Copper ($literal) and Malachite (CU2 (OH) 2co3). Copper stone smelt copper, and purified copper was finally refined by electrolysis.